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Update time：2022-04-29 17:04
Index > Product > 深圳市金航标电子有限公司 > chip > Power management KH1(G4)C100-B02
Power management KH1(G4)C100-B02

Power management KH1(G4)C100-B02

深圳市金航标电子有限公司 - Company profile Click chip
Network interface 56-8p8c all inclusive View details 》
  • KH1(G4)C100-B02
    encapsulation：KH1(G4)C100-B02
  • 212
    browsers：212
  • In production
    cycle：In production
  • 2021
    time：2021
  • 1.00
    Reference price： 1.00
by Jihzx.com

Power management KH1(G4)C100-B02 Manufacturer introduction

供应商名称：深圳市金航标电子有限公司

Power management KH1(G4)C100-B02 Data specification parameters

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Power management KH1(G4)C100-B02
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Power management KH1(G4)C100-B02 Data book

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Power management KH1(G4)C100-B02 Related devices

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Power management KH-FFC-A0.5-22P-100MM
Power management
KH-FFC-A0.5-22P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel overall gold plating 3.0 * 1.0 * 1.4h
1.00
Power management KH-FFC-A0.5-20P-100MM
Power management
KH-FFC-A0.5-20P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel overall gold plating 2.8 * 1.55 * 1.4h
1.00
Power management KH-FFC-A0.5-18P-100MM
Power management
KH-FFC-A0.5-18P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel contact gold plating 3.5 * 1.0 * 1.4h
1.00
Power management KH-FFC-A0.5-16P-100MM
Power management
KH-FFC-A0.5-16P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel contact gold plating 3.4 * 0.9 * 1.5h
1.00
Power management KH-FFC-A0.5-14P-100MM
Power management
KH-FFC-A0.5-14P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel overall gold plating 3.5 * 1.5 * 1.5h
1.00
Power management KH-FFC-A0.5-12P-100MM
Power management
KH-FFC-A0.5-12P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel contact gold plating 3.5 * 1.5 * 1.6h
1.00
Power management KH-FFC-A0.5-10P-100MM
Power management
KH-FFC-A0.5-10P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel contact gold plating 3.4 * 0.9 * 1.8h
1.00
Power management KH-FFC-A0.5-8P-100MM
Power management
KH-FFC-A0.5-8P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel contact gold plating 2.8 * 1.55 * 2.0h
1.00
Power management KH-FFC-A0.5-6P-100MM
Power management
KH-FFC-A0.5-6P-100MM
深圳市金航标电子有限公司
chip
Metal shrapnel overall gold plating 3.4 * 0.9 * 2.0h
1.00
Power management KH-1110-UB8X
Power management
KH-1110-UB8X
深圳市金航标电子有限公司
chip
Metal shrapnel overall gold plating 3.0 * 0.9 * 2.2h
1.00
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